When AI Chips Overheat: How PCBs Are Evolving from Insulators to Heat Sinks
As AI GPUs push past 1,000W per chip, traditional FR-4 PCBs can no longer handle the heat. This article explores how PCBs are evolving from simple insulating substrates into core thermal conduits—covering thermal via arrays, metal core PCBs (MCPCB), and embedded copper coins—and the manufacturing challenges that come with them.
